How to use this glossary
This note explains semiconductor-policy terms as they are used in the official Semicon 2.0 release. It does not treat every chip term as a complete material-science definition.
Essential terminology
- Chip design and design IP
- Semicon 2.0 supports chip and system design, reusable design building blocks and design intellectual property.
- Fab
- A semiconductor manufacturing facility. The official framework distinguishes silicon fabs, compound-semiconductor fabs, discrete-component fabs and display fabs.
- Node
- A manufacturing-technology label used in the official release. Semicon 2.0 describes India’s current journey as 28 nm–110 nm and identifies more advanced nodes as a research and development priority.
- ATMP and OSAT
- Terms used for the chip assembly, testing and packaging part of the semiconductor ecosystem. Semicon 2.0 treats this as a distinct pillar alongside fabrication and design.
- EDA tools
- Electronic Design Automation tools used for chip design work. The release records their use by universities and supported semiconductor-design companies.
Why semiconductor capacity is strategic
- The official framework links semiconductor design and manufacturing with supply-chain resilience, national security and technological leadership.
- The ecosystem spans design, machines and materials, fabrication, packaging and testing, research and development, and skills.
- Approved packaging units are expected to serve sectors including electronics, automobiles, telecommunications, aerospace and power electronics.
Evidence reference
Press Information Bureau, 15 July 2026: Cabinet approval and six pillars of Semicon 2.0
Quick self-check
- What happens inside a fab?
- Where do ATMP and OSAT fit in the semiconductor ecosystem?
- What role do EDA tools play?